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Viavi Solutions SIM Broadcom Bonded xDSL Module (HST3000-BDCM-WB21)

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Viavi Solutions SIM Broadcom Bonded xDSL Module (HST3000-BDCM-WB21)

Brand: Viavi Solutions           P\N: HST3000-BDCM-WB21           UPC: 729198131609

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Availability: Usually Ships Same Day
Condition: New


Your Price: $311761


List Price: $3,821.00




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Description


Viavi Solutions VIAVI HST-3000 SIM BDCM-WB2-1 Broadcom Bonded xDSL Module. For use with HST-3000 and HST-3000C mainframes. 2mm copper interace connectors at the top of the SIM can be used for both copper testing and xDSL testing.

Key Features:
  • Overall features & capabilities of the HST-3000 test platform are listed in this section. Additional HW & SW options maybe required.
  • A single testing solution for multiple access technologies and service applications
  • Modular hardware and software architecture that is flexible and easily upgraded
  • Automated closeout tests and customized M&P's test scripts for lowering repair repeat rates
  • Laptop/PC integration via USB interfaces


Features


  • Special Order Product. Non-Cancellable and Non-Returnable.



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