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List Price: $3,821.00
VIAVI HST-3000 SIM BDCM-WB2-1 Broadcom Bonded xDSL Module. For use with HST-3000 and HST-3000C mainframes. 2mm copper interace connectors at the top of the SIM can be used for both copper testing and xDSL testing.
Overall features & capabilities of the HST-3000 test platform are listed in this section. Additional HW & SW options maybe required.
A single testing solution for multiple access technologies and service applications
Modular hardware and software architecture that is flexible and easily upgraded
Automated closeout tests and customized M&P's test scripts for lowering repair repeat rates
Laptop/PC integration via USB interfaces
Special Order Product. Non-Cancellable and Non-Returnable.
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